Huawei’s Kirin 990 chipset may have something that no Snapdragon SoC can offer

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A YouTube video posted today by Huawei titled Huawei Kirin 990 Warm-up reveals that the chip will be introduced at the upcoming IFA show in Berlin on September 6th. Designed by the company’s HiSilicon unit and manufactured by TSMC using the 7nm EUV process, the chip will be powering the Mate 30 line. And Yanmin Wang, a regional president with Huawei’s Consumer Business Group, told TechRadar …

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